product standards zener diode DZ3X056D0L ? absolute maximum ratings ta = 25 ? c *1: mounted on glass epoxy print board. ( 45 mm x 45 mm x 1 mm)(2 diode total) solder in ( 1.0 mm x 1.0 mm) *2: ? electrical characteristics ta = 25 ? c ? 3 ? c 1. 2. *1: the temperature must be controlled 25c for vz mesurement. vz value measured at other temperature must be adjusted to vz (25c) *2: vz guaranted 20 ms after current flow. *3: tj = 25c to 150c page note) test method:iec61000_4_2(c = 150 pf,r = 330 ? , contact discharge:10 times) note) measuring methods are based on japanese industrial standard jis c 7031 measuring methods for diodes. 0.5 a ir vr = 2.5 v 200 ? +150 c 200 zener rise operating resistance rzk iz = 0.5 ma total power dissipation *1 pt mw electrostatic discharge *2 storage temperature tstg -55 to temperature coefficient of zener voltage *3 sz iz = 5 ma zener voltage *1, *2 vz iz = 5 ma zener operating resistance rz iz = 5 ma reverse current ? packaging embossed type (thermo-compression sealing) 3 000 pcs / reel (standard) parameter symbol rating unit (eu rohs / ul-94 v-0 / msl:level 1 compliant) ? marking symbol : 0w code 1. cathode1 2. cathode2 to-236aa/sot-23 panasonic DZ3X056D0L silicon epitaxial planar type for surge absorption circuit ? features ?? ? low zener operating resistance rz excellent rising characteristics of zener current izhalogen-free / rohs compliant mini3-g3-b jeita sc-59a 3. anode1,2 1of4 unit: mm min typ 10 kv junction temperature tj 150 c esd v parameter symbol conditions forward voltage vf if = 10 ma unit 5.32 max 5.88 1.0 internal connection 2.0 mv/c v 40 ? +85 c operating ambient temperature topr -40 to 12 3 2.8 2.9 1.1 1.5 0.4 1.9 0.16 1 3 (0.95) (0.95) 2 doc no. tt4-ea-14185 revision. 4 established : 2012-06-03 revised : 2013-10-22 downloaded from: http:///
product standards zener diode DZ3X056D0L technical data ( reference ) page 2 of 4 pt - ta 0 50 100 150 200 250 0 20 40 60 80 100 120 140 160 180 200 ambient temperature ta (c) total power dissipation pt (mw) mounted on glass epoxy print board (2 diode total)board size : 45 mm 45 mm x 1 mm solder in : 1.0 mm x 1.0 mm if - vf 1.e-06 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 0.0 0.2 0.4 0.6 0.8 1.0 1.2 forward voltage vf (v) forward current if (a) ta = 25 ir - vr 1.e-12 1.e-11 1.e-10 1.e-09 1.e-08 1.e-07 1.e-06 0 0.5 1 1.5 2 2.5 reverse voltage vr (v) reverse current ir (a) ta = 25 iz - vz 1.e-06 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 024681 0 zener voltage vz (v) zener current iz (a) ta = 125 85 -40 25 sz - iz -5 -3 -1 1 3 5 024681 0 zener current iz (ma) temparature coefficient of zener voltage sz (mv/c) rz - iz 0.1 1 10 100 0.0001 0.001 0.01 0.1 zener current iz (a) zener operating resistance rz ?? ) ta = 25 doc no. tt4-ea-14185 revision. 4 established : 2012-06-03 revised : 2013-10-22 downloaded from: http:///
product standards zener diode DZ3X056D0L technical data ( reference ) page 3 of 4 ct - vr 0 5 10 15 20 25 30 35 40 012345 reverse voltage vr (v) terminal capacitance ct (pf) ta = 25 f = 1 mhz rth - t 1 10 100 1000 0.001 0.01 0.1 1 10 100 1000 time t (s) thermal resistance rth (c/w) (1) rth(j-l) = 100 /w (1) non-heat sink(2) mounted on glass epoxy print board. board size : 45 mm 45 mm x 1 mm solder in : 1.0 mm x 1.0 mm (2) pzsm - tw 0.1 1 10 100 100 1000 10000 pulse width tw ( s) non-repetitive reverse surge power dissipation pzsm (w) ta = 25 doc no. tt4-ea-14185 revision. 4 established : 2012-06-03 revised : 2013-10-22 downloaded from: http:///
product standards zener diode DZ3X056D0L unit: mm page mini3-g3-b ? 4 of 4 land pattern (reference) (unit: mm) 2.8 +0.2-0.3 1.50 +0.25-0.05 0.16 +0.10-0.06 0 to 0.1 1.9 0.1 2.90 +0.20 -0.05 (0.65) (0.95) (0.95) 0.4 0.2 1.1 +0.3-0.1 1.1 +0.2-0.1 (5) (10) 0.40 +0.10-0.05 12 3 1.0 1.9 2.4 1.0 doc no. tt4-ea-14185 revision. 4 established : 2012-06-03 revised : 2013-10-22 downloaded from: http:///
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-resident s, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to sh ow the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual p roperty right or other right owned by panasonic corporation or any other c ompany. therefore, no responsibilit y is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. (3) the products described in this book are intended to be used for general a pplications (such as office equipment, communications equipment, measuring instruments and household applian ces), or for specific applications as expressly stated in this book. please consult with our sales staff in advance for information on the follo wing applications, moreover please exchange documents separately on terms of use etc.: special applications (such as f or in-vehicle equipment, airplanes, aerospace, automotive equipment, traffic signal ing equipment, combustion equipme nt, medical equipment and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. unless exchanging documents on terms of use etc. in advance, it is to be unde rstood that our company shall not be held responsible for any damage incurred as a result of or in connection with you r using the products described in this book for any special application. (4) the products and product specific ations described in this book are sub ject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use o f the products, therefore, ask for the most up- to-date product standards in advance t o make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maxim um rating and the guaranteed operating conditions (operating power supply v oltage and operating environment et c.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power- on, power-off and mode-switching. other- wise, we will not be liable for any defect which may arise later in your equip ment. even when the products are used withi n the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures o n the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external fact ors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. we do not guarantee quality for disassembled p roducts or the product re-mounte d after removing from the mounting board. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) when reselling products described in this book to other companies with out our permission and receiving any claim of request from the resale destination, please understand that customers wi ll bear the burden. (8) this book may be not reprinted or reproduced whether wholly or partiall y, without the prior written permission of our company. no.010618 downloaded from: http:///
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